美国 3000 Technology Drive Angleton, TX
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Benchmark Electronics, Inc.
业务介绍
Smallest Part _ 0201, Smallest Leaded Pitch _ 12 mil
R&D to Implement 01005 Parts
Largest BGA _ 55mm x 55mm (up to 4000 ball count)
Automatic BGA Placement up to 2015 I/O Pins on a 1 mm Pitch
PCA Mfg. _ 24” x 32” x .25 x 18 lb (up to 40” wide)
Network Interface cards (NIC)
Ball Grid Array, _BGA Assembly
Chip on Board
Flip Chip
Component Programming
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