Microchip: Structural Divergence Emerging Across the MCU Market
Microchip’s general-purpose MCU pricing has remained relatively stable, with some consumer-grade products experiencing a modest recovery. In contrast, automotive-grade and aerospace-grade products continue to maintain significant premiums, with high-end products such as the SAM series and PolarFire FPGA maintaining market prices approximately 10%–20% above normal levels. From a supply perspective, lead times for general-purpose MCUs remain at 8–14 weeks, while automotive and industrial-grade products are typically at 12–20 weeks. Aerospace-grade FPGA/SoC products continue to face extended lead times of 40–52 weeks. As consumer inventory levels gradually normalize, market demand is showing a moderate recovery. Meanwhile, demand growth in AI power, industrial IoT, and new energy applications continues to accelerate. As manufacturers increasingly prioritize capacity allocation toward automotive, high-reliability, and higher-margin products, the market is showing a clear structural divergence: supply availability for general-purpose products is improving, while high-end specialized products remain under tight supply constraints.
TI: Industrial and Automotive Analog Supply Continues to Tighten
TI continues to allocate part of its capacity toward AI server power-related products, resulting in further extensions of lead times for industrial and automotive analog devices. Multiple distribution channels have adopted a more cautious approach toward new orders, with product lead times and pricing showing increased volatility. TI is prioritizing deliveries for direct customers, while special pricing approval cycles have become longer, with some order processing periods extending several weeks. Recently, inquiries for TI automotive-grade products have increased significantly. Several high-demand automotive components are experiencing limited spot availability, triggering market purchasing activity. Prices for some constrained models have risen significantly above normal market levels.
Xilinx: High-Demand Product Families Remain Supply-Constrained
Xilinx’s high-end FPGA supply remains tight, with limited availability across the Versal, Virtex UltraScale+, and Zynq UltraScale+ families. Driven by increasing demand from AI infrastructure, telecommunications, industrial automation, and aerospace applications, orders for these product lines continue to grow, while delivery cycles remain extended. Automotive-grade and industrial-grade versions are facing the most severe constraints, with lead times for some high-demand networking and AI-related devices extending beyond 40–52 weeks. As AI computing demand continues to expand, competition for high-end FPGA capacity is expected to remain intense.
Infineon: High-End Power Devices Continue to See Price Increases
Infineon’s market conditions continue to reflect structural supply shortages. Previous price adjustments have gradually taken effect, with affected products seeing increases of approximately 8%–22%. The company continues to prioritize 8-inch wafer capacity toward AI power solutions, automotive high-voltage devices, and SiC products, resulting in reduced availability of industrial general-purpose products and further widening supply-demand differences across segments. Confirmed order price increases are currently concentrated in the 8%–15% range. Entering Q3, automotive-grade inventory levels continue to decline, with TLE transceiver products facing particularly significant supply pressure. Shortages have already emerged among automotive customers in Europe and Asia-Pacific. If supply constraints persist, the automotive electronics market could face a shortage scenario similar to the disruption experienced in 2021.
Onsemi: SiC MOSFET Supply Remains Highly Constrained
Onsemi’s most constrained products remain concentrated in silicon carbide (SiC) MOSFETs, particularly the EliteSiC 650V product family. Driven by increasing demand from electric vehicle manufacturers, significant production capacity has been allocated to automotive programs, leaving spot-market availability extremely limited. Current lead times for related products remain at 26–40 weeks, with some high-specification models requiring even longer delivery cycles. In addition, certain IGBT modules remain under allocation-based supply, while spot-market pricing continues to fluctuate based on inventory levels and urgent project requirements.
Samsung: Automotive Applications Continue to Drive Growth
Samsung’s MLCC market is currently experiencing clear structural differentiation, with demand concentrated primarily in three major areas: AI servers, new energy vehicles, and traditional consumer electronics. In AI servers, MLCC usage per system is approximately 10–13 times higher than in conventional servers, while capacitance requirements can increase by around 27 times. A single GB-class AI server may require hundreds of thousands of MLCC units, making AI infrastructure a key driver of premium MLCC demand growth. In automotive applications, electric vehicles use approximately six times more MLCCs than internal combustion engine vehicles. The continued adoption of 800V high-voltage platforms, ADAS, and battery management systems (BMS) is accelerating demand for high-capacitance and high-voltage MLCC products. Samsung’s automotive MLCC business continues to expand, with automotive product pricing showing significant year-over-year increases. The consumer electronics market is recovering gradually; however, as AI-related applications consume increasing capacity, general-purpose MLCC products continue to face longer lead times and upward pricing pressure. At the same time, emerging AI devices such as AI smartphones and AI PCs are increasing MLCC content per device, providing additional market support.
Renesas: Automotive MCUs and Power Products Remain in Short Supply
Renesas implemented a new round of price adjustments starting July 1, covering automotive MCUs, industrial power ICs, driver ICs, and analog signal chain products, with overall increases of approximately 8%–15%. Market conditions remain highly differentiated. Constrained products are trading at spot premiums of approximately 15%–30%. Automotive MCU products including H8/300H, high-end R5F automotive series, and ISL power management products have lead times extending to 24–38 weeks, with limited spot availability. In contrast, some mature general-purpose products have sufficient inventory. Prices for certain RSF series products and general-purpose ISL devices have declined significantly, with some spot prices even falling below post-adjustment factory pricing. Entry-level R5F MCUs, general-purpose operational amplifiers, and lower-end industrial microcontrollers have seen lead times normalize to 8–14 weeks, with authorized distribution channels maintaining relatively healthy inventory levels.
Intel: AI Business Drives Stronger Financial Performance
Intel’s second-quarter performance exceeded market expectations, supported by accelerating demand for AI infrastructure. The company achieved one of its stronger year-over-year revenue growth rates in recent years. According to its financial results, Intel generated second-quarter revenue of US$16.1 billion, representing a 25.4% year-over-year increase. Adjusted EPS reached US$0.42, while adjusted gross margin recovered to 41.8%. From a business perspective, the Data Center and AI segment became the primary growth driver, with revenue increasing 59% year over year to US$6.26 billion. Intel stated that demand from data center customers continues to strengthen, with current market demand exceeding the company’s available supply capacity.