TI: Lead Times for SN74 and OPA Series Continue to Deteriorate
Supply of several high-demand TI analog products continues to tighten, with lead times for the SN74 logic series and OPA operational amplifier series extending to February 2027 through January 2028. According to supply chain feedback, some customers have been waiting for more than 32 weeks after placing orders without receiving deliveries, compared with the previous standard lead time of approximately 16 weeks. TI has not publicly disclosed the specific reasons behind the supply constraints. However, the market generally attributes the situation to two key factors. First, rapidly growing demand for AI servers has resulted in significant wafer capacity being prioritized toward AI-related applications. Compared with traditional servers, AI systems require substantially higher semiconductor content, further reducing available capacity for industrial and general-purpose analog products. Second, TI continues to carefully manage shipment volumes, improving product profitability amid rising manufacturing costs. As a result, the analog semiconductor market is increasingly shifting toward a supplier-driven environment.
ST: Mature-Node Capacity Remains Under Pressure
ST continues to face tight wafer capacity conditions. Internal manufacturing capacity and external foundry resources, including those from Hua Hong Semiconductor, are being prioritized for major AI server and automotive customers in Europe and North America. As a result, smaller domestic customers and consumer electronics customers are facing greater difficulty securing capacity allocations, with some demand shifting toward higher-priced spot markets. In addition, certain 90nm wafer production is outsourced to TSMC, while TSMC continues to allocate both advanced and mature-node capacity toward AI-related applications, further impacting supply availability for other market segments. Multiple STM32 product families remain under significant delivery pressure. Lead times for the F0, F1, and F3 series are currently above 40 weeks, while the G0, G4, L4, F4, and F7 series have extended beyond 52 weeks. Due to prolonged supply uncertainty, the market has seen increasing cases of double and triple ordering, where customers place repeated orders to improve the probability of securing allocation. Supply conditions are expected to improve slightly in Q3 2026; however, shipments may decline again from Q4 onward. Continued monitoring of supply risks remains necessary.
Onsemi: Divesting Two Manufacturing Facilities
Onsemi has announced the divestment of two manufacturing facilities as part of its ongoing manufacturing optimization strategy. The Tarlac assembly and test facility in the Philippines will be sold to Taiwan-based Greatek Electronics, with completion expected within three to six months. Meanwhile, the Mountain Top wafer fabrication facility in Pennsylvania, U.S., will be acquired by Sweden-based Silex Microsystems, with the transaction expected to close in January 2028. The two facilities are primarily involved in the production of power semiconductor products and low- to medium-voltage MOSFETs. Onsemi stated that both facilities will continue normal operations during the transition period, supported by long-term supply agreements to ensure customer supply continuity. However, manufacturing resource adjustments and production line transfers may still create temporary impacts on delivery schedules for certain products. Customers are advised to closely monitor supply changes for related power semiconductor and MOSFET products.
Micron: Expanding Automotive Memory Partnerships
Micron has announced long-term supply agreements with automotive ecosystem companies including Qualcomm and Harman to provide memory and storage solutions for AI-enabled vehicles. As AI capabilities rapidly expand into automotive applications, advanced storage requirements for autonomous driving, ADAS, and high-end digital cockpits are increasing significantly. At the same time, demand growth from AI servers, consumer electronics, and automotive electronics continues to accelerate the global memory market. Major memory manufacturers are increasing investment in capacity expansion to address long-term supply-demand pressure.
Intel: Nova Lake-S Production Strategy Shift Toward Higher In-House Manufacturing
Market sources indicate that Intel has adjusted the production strategy for its next-generation Nova Lake-S processors. The original plan, which involved approximately 60%–70% of wafers being manufactured by TSMC using its 2nm process, has reportedly been revised, with Intel now expected to rely primarily on its own Intel 18A process technology. The outsourcing ratio may fall below 20%. Industry analysts believe the adjustment reflects improvements in Intel 18A process yields, demonstrating progress in Intel’s advanced manufacturing capabilities and narrowing the technology gap with TSMC. Although Intel’s reduced reliance on TSMC may affect some 2nm capacity allocation, TSMC’s advanced-node capacity remains highly sought after. Apple, NVIDIA, AMD, and other HPC customers are expected to quickly absorb the available capacity.
Broadcom Partners with Powertech to Advance Advanced Packaging
OSAT provider Powertech Technology (PTI) has announced plans to establish a panel-level advanced packaging (PLP) manufacturing joint venture with Broadcom in Singapore, with total investment estimated at approximately US$400 million. The partnership aims to strengthen advanced packaging capabilities while positioning manufacturing closer to global customer supply chains. As demand for AI chips and high-performance computing continues to grow, advanced packaging has become a critical technology for improving chip performance. Through investment in PLP technology, Broadcom is further strengthening its AI semiconductor supply chain ecosystem.
Samsung: AI PC Processor Gaia Enters Testing Phase
Samsung’s System LSI division is advancing development of its AI-focused processor “Gaia.” The chip has reportedly entered sample testing and has been provided to PC manufacturers including HP and Lenovo for performance validation. If testing progresses successfully and the product enters mass production, Samsung will further expand its presence in the AI PC processor market, strengthening competitiveness in AI-enabled consumer devices while promoting synergy across its semiconductor, memory, and device ecosystems.
MediaTek Expands CPO Technology Development to Capture AI Data Center Optical Interconnect Opportunities
MediaTek has continued to strengthen its investment in co-packaged optics (CPO) technology. In addition to its strategic investment in U.S.-based silicon photonics company Ayar Labs, MediaTek is deepening collaboration with industry partners including Microsoft and TSMC to explore high-speed optical interconnect solutions for AI data centers. By expanding beyond ASIC chip design into integrated optoelectronic platforms, MediaTek aims to capitalize on the growing demand for high-bandwidth communication infrastructure in AI data centers and further expand its presence in the AI infrastructure market.