ST: New Round of MCU Price Increases Underway
ST has initiated price adjustments for selected MCU product lines, driven by rising foundry costs and a gradual recovery in end-market demand. According to market sources, the latest round of MCU price increases officially took effect on June 28. Capacity at mature process nodes remains constrained, with resources increasingly prioritized toward AI-related applications such as PMICs. At the same time, growing demand from edge AI, industrial automation, and intelligent control applications continues to strengthen the MCU market outlook. According to Omdia, ST has further expanded its share of the global general-purpose MCU market and has maintained the No. 1 position worldwide for five consecutive years. Supported by both cost pressures and demand growth, MCU pricing is expected to retain upward momentum in the coming quarters.
TI: Comprehensive Product Price Increase Approaching
TI has announced that it will implement a broad pricing adjustment across its entire product portfolio beginning July 1, 2026, with most products expected to see increases ranging from 15% to 35%. The analog IC market remains under supply pressure, with certain legacy devices and power management products experiencing price increases exceeding 85%. Demand remains particularly strong for the TPS series DC/DC converters, TLV low-voltage low-power devices, and OPA operational amplifiers, all of which continue to face tight spot-market availability. As the latest pricing measures take effect, average market pricing for analog and power management products is expected to move higher.
ADI: Growing Demand from Industrial and Automotive Markets
ADI continued to experience solid demand growth throughout the month, with customer inquiry activity increasing and pricing for general-purpose products rising across multiple categories. From a supply perspective, automotive-grade and industrial isolation products continue to receive priority allocation toward new energy and industrial automation applications. Lead times for high-end isolation devices and high-speed ADCs have continued to extend. Allocation remains tight for industrial isolation solutions, high-voltage power products, and high-speed ADCs, with products such as ADM2587 and LT1076CQ experiencing particularly constrained supply. Supported by continued growth in renewable energy, industrial automation, and AI-related applications, ADI product pricing is expected to remain on an upward trajectory through the second half of the year.
Infineon: Power Semiconductor Market Remains Strong
Infineon’s power semiconductor business continues to operate in a high-demand environment. Spot-market premiums for discrete IGBTs and power modules currently range from approximately 10% to 25%, while automotive-grade high-voltage MOSFETs and SiC devices command premiums of up to 30%–50%. In contrast, pricing for low-voltage MOSFETs and general-purpose MCUs has remained relatively stable. However, demand from electric vehicles, energy storage systems, and AI power infrastructure continues to support a tight supply-demand balance for high-voltage power semiconductors and automotive-grade products, a situation that is expected to persist through the first half of 2027. Market participants generally believe that a broad easing of supply conditions for high-voltage and automotive-grade products is unlikely in the near term. Customers are therefore advised to plan procurement cycles for SiC devices and high-voltage IGBTs well in advance to mitigate supply risks.
Micron: AI Demand Continues to Strengthen the Memory Market
Micron’s latest earnings outlook indicates that both quarterly revenue and profitability are expected to significantly exceed market expectations. The company also disclosed that certain customers have committed approximately US$22 billion to secure future memory supply. Continued investment in AI data centers is driving rapid growth in demand for high-performance memory products, supporting a new upcycle in the memory market. Major cloud service providers and AI companies are increasingly securing capacity through long-term commitments, further reinforcing the industry’s tight supply-demand dynamics.
Xilinx: FPGA Market Remains Constrained as AI Demand Intensifies Structural Shortages
The Xilinx FPGA market continues to face significant supply shortages, with product prices rising and lead times extending across multiple product families. The rapid expansion of AI and data center applications has become the primary growth driver, with demand for FPGAs in advanced AI computing servers estimated to be three to five times higher than in traditional server platforms.At the same time, a significant portion of advanced manufacturing capacity is being allocated to AI-focused FPGA products, reducing supply availability for mainstream and mid-range devices. Growing demand from industrial automation, telecommunications infrastructure, and automotive electronics is further exacerbating structural shortages across the FPGA market.
Qualcomm Acquires Modular
Qualcomm has announced an agreement to acquire Modular, strengthening its software capabilities in Generative AI and Agentic AI technologies. By integrating Modular’s technologies, Qualcomm aims to further enhance its AI software infrastructure for data center and edge computing environments, improving cross-platform AI inference, deployment, and optimization capabilities. The acquisition is also expected to strengthen Qualcomm’s ecosystem partnerships with model developers, cloud service providers, and enterprise customers, supporting the continued expansion of its AI data center strategy.
Renesas Completes Acquisition of Pictorus
Renesas Electronics has announced the completion of its acquisition of software developer Pictorus. Through the transaction, Renesas gains access to cloud-based behavioral modeling technology that enables engineers to accelerate embedded system design and validation processes. The acquisition will further enhance the capabilities of the Renesas 365 platform. As Renesas’ next-generation electronics system development platform, Renesas 365 spans the entire workflow from solution exploration and product development to lifecycle management, while promoting a more integrated and collaborative approach to electronic system design.