TI: Lead Times Extended to 180 Days
TI has officially announced a comprehensive price increase across its entire product portfolio effective July 1, 2026, with adjustments ranging from 10% to 85%. Order booking lead times have now been extended to 180 days. At the same time, quotation approval requirements have become significantly more stringent, requiring customers to provide detailed end-customer information and project roadmaps before pricing can be issued. The TPS, TLV, and LMR product families are among the most heavily impacted. Customers in the automotive and industrial sectors have already reported order cancellations and the introduction of expedite fees to secure supply.
Renesas: Power Device Lead Times Exceed 52 Weeks
Renesas continues to face pressure on supply stability as demand for power management devices increases significantly. Lead times for certain products have now exceeded 52 weeks, with high-demand models such as the ISL99390FRZ experiencing particularly tight supply conditions. Market sources indicate that Renesas may implement another round of price increases starting July 1, 2026, with expected adjustments ranging from 5% to 50%. In addition, the company’s ongoing divestiture of its timing device business has heightened market attention regarding future product roadmaps and supply continuity. Several OEMs have reportedly begun evaluating alternative sourcing strategies to mitigate supply-chain risks.
ST: Automotive and Industrial Products Lead Price Increases
Market conditions for ST continue to diverge across product segments. Automotive-grade and industrial-grade MCUs and power devices have become the primary drivers of the latest price increases, while consumer-grade MCUs remain relatively stable, with some models even experiencing price corrections. Driven by persistent AI-related demand consuming both 8-inch and 12-inch wafer capacity, rising raw material and foundry costs, and steady demand growth from automotive and industrial markets, ST has been implementing phased price adjustments since April 2026 and is expected to complete price increases across its full product portfolio between June and July. Automotive and industrial products are expected to rise by approximately 5%–15%, while general-purpose MCUs are projected to increase by 3%–8%.
Infineon: New Price Adjustment Scheduled for July
Infineon will implement another round of price increases effective July 1, 2026, covering power MOSFETs, PMICs, power management ICs, IGBTs, power modules, and AI server power solutions. Meanwhile, Infineon’s new wafer fabrication facility in Germany officially entered production in July. Based on currently available information, the company has no additional greenfield fab construction projects planned in the near term.
Samsung: Capacity Continues to Shift Toward AI Memory
Samsung continues to allocate a growing share of production capacity toward high-value AI server memory products, including HBM and high-performance DRAM. As a result, capacity allocated to conventional memory products has declined further. The shift has already led to shortages of certain mainstream memory products. Market expectations suggest Samsung could launch another round of price increases as early as June, potentially exceeding 30%. Many distributors have already suspended acceptance of selected orders, while lead-time visibility remains limited. In parallel, Samsung plans to invest approximately US$1.5 billion in a semiconductor testing facility in Vietnam to expand backend manufacturing capacity and help address rapidly growing global demand for AI-related memory products.
Murata: Tight Supply of AI Server and Automotive MLCCs
Murata has recently implemented broad price increases for MLCCs used in AI servers and high-end automotive applications, with adjustments ranging from approximately 15% to 35%. Demand for these products remains strong, and lead times have extended to 16–24 weeks. In comparison, general-purpose consumer MLCCs have seen more moderate price increases of around 5%–10%, with lead times remaining relatively stable at approximately 10–12 weeks. To support future demand growth, Murata has announced an additional investment of roughly JPY 80 billion to expand production capacity, with most of the new capacity expected to target demand anticipated in 2027 and beyond.
Marvell: Custom AI Chip Business Accelerates Growth
Marvell expects revenue from its custom ASIC business to exceed US$10 billion by fiscal year 2029. As global cloud service providers continue expanding AI data center infrastructure, a growing number of customers are adopting custom silicon solutions to reduce dependence on GPUs and optimize overall system costs. Leveraging its strengths in custom ASIC design and high-speed interconnect technologies, Marvell is emerging as a key beneficiary of the expanding AI infrastructure market.
Qualcomm: Reportedly Reaches AI ASIC Partnership with ByteDance
According to market reports, Qualcomm has entered into an AI ASIC partnership with ByteDance to provide dedicated AI accelerator chips for the company’s AI data center deployments. ByteDance is reportedly planning to procure millions of AI ASIC devices to support the expansion of AI Agent platforms and large-scale AI model infrastructure. The collaboration could also facilitate the commercialization of certain in-house AI chip initiatives at ByteDance, while representing an important step in Qualcomm’s broader strategy to expand into the AI infrastructure market.