Samsung: MLCC Prices and Lead Times Continue to Rise
Samsung’s MLCC business remains in a persistently tight supply-demand environment, driven by rapidly expanding demand from high-growth sectors such as AI servers and new energy vehicles (NEVs). The resulting imbalance has become particularly pronounced in the high-end segment. According to market feedback, production schedules for premium MLCC products have already been extended through 2028, with certain models experiencing prolonged shortages. Lead times for mainstream products have increased from approximately 10 weeks to 20–24 weeks, while automotive-grade inventory remains especially constrained.Among the most affected products, 0603 and 1206 package sizes account for roughly 70% of shortage-related inquiries. High-capacitance MLCCs, including 10μF, 22μF, and 47μF variants, continue to face demand that significantly exceeds available supply, with X5R and X7R dielectric materials remaining the most sought-after specifications. From a pricing perspective, high-end AI and automotive-grade MLCCs are expected to see a further 10%–20% increase during the second half of the year. Although price growth for general-purpose products has moderated, the likelihood of near-term price declines remains low. Overall, average MLCC pricing is expected to rise by approximately 30%–50% over the course of the year.
TI: Second Round of Price Increases Approaches as Channel Inventory Tightens
TI is preparing to implement another round of price increases, prompting distributors to adopt increasingly conservative inventory release strategies. Prices for mainstream products have already risen by approximately 40% cumulatively. Demand for high-volume, high-demand components remains strong, while spot inventory continues to tighten. On the supply side, TI continues to prioritize direct customers, resulting in limited overall channel allocations during Q3. Major distributors such as Arrow have begun deploying AI-driven order management systems to strengthen allocation control, further extending order scheduling cycles. While a handful of products that experienced excessive price increases earlier have recently seen modest corrections, the broader market remains fundamentally strong.
NXP: Phased Pricing Strategy Continues
NXP will launch another round of price adjustments effective July 1, with additional product families that were previously exempt expected to be included. The latest pricing strategy is being implemented in phases. The first round, completed in April, primarily targeted selected mature-node products and small-to-medium-sized customers. In June, pricing adjustments focused on large accounts to offset rising raw material costs. Beginning in July, the remaining product portfolio and customer groups are expected to be incorporated into the pricing program. Overall, NXP is pursuing a structured and phased pricing recovery strategy designed to minimize market disruption while gradually restoring profitability across its product portfolio.
Xilinx: TSMC Capacity Constraints Impact Product Deliveries
Xilinx continues to face supply challenges as ongoing constraints at TSMC’s advanced process nodes affect production availability. Lead times for XC6-series products have extended to approximately 20 weeks, and some newly placed orders are unlikely to receive meaningful deliveries within the current year. Efforts by customers and distributors to coordinate supply with the manufacturer have yielded limited results. At the same time, Xilinx is reportedly preparing to implement NCNR (Non-Cancelable, Non-Returnable) policies to eliminate non-genuine demand and improve capacity allocation efficiency. Some end customers have already begun evaluating alternative solutions to mitigate supply-chain risks.
NVIDIA: Vera CPU Expected to Open for Orders in August
Market reports indicate that NVIDIA has informed customers in China that its next-generation Vera CPU for AI data centers could become available for ordering as early as August. As export restrictions on advanced AI chips continue to impact business operations, NVIDIA is accelerating the introduction of new products to strengthen its competitiveness in the Chinese market. NVIDIA’s CEO previously acknowledged that the company’s share of China’s AI accelerator market has declined significantly due to export controls. The launch of the Vera CPU is also expected to intensify competition with established server CPU vendors such as AMD and Intel within the rapidly expanding AI data center market.
Infineon: Dresden Power Semiconductor Fab Nears Production Launch
Infineon has announced that its new power semiconductor wafer fabrication facility in Dresden, Germany, will officially begin operations on July 2. With a total investment of approximately €5 billion, the project represents the largest single investment in the company’s history. The facility also received roughly €1 billion in support under the European Chips Act and is widely regarded as a key milestone in Europe’s efforts to strengthen semiconductor self-sufficiency. Once operational, the fab is expected to significantly enhance Infineon’s supply capabilities across automotive electronics, industrial automation, and energy applications.
Intel Secures Google TPU Manufacturing Order
According to market sources, Google has selected Intel to manufacture a portion of its TPU processors, with total orders reportedly exceeding three million units and mass production expected to begin in 2028. The agreement highlights growing recognition of Intel’s advanced process technologies among leading AI customers and reflects increasing demand for alternative manufacturing sources as TSMC’s advanced-node capacity remains fully utilized. In addition, NVIDIA and several other AI chip developers are reportedly evaluating Intel’s advanced packaging and manufacturing capabilities, potentially opening the door to future strategic collaborations.
TDK Plans US$400 Million Acquisition of Fabric8Labs
TDK has announced plans to acquire U.S.-based advanced thermal management company Fabric8Labs in a transaction valued at up to US$400 million. The agreement includes an earnout structure tied to future business performance in addition to the initial acquisition consideration. Fabric8Labs possesses strong expertise in advanced cooling components and liquid-cooling technologies, making it a strategic addition to TDK’s growing AI data center infrastructure portfolio. Following completion of the acquisition, TDK is expected to further strengthen its AI server thermal management solutions and capitalize on the rapid expansion of AI data center infrastructure worldwide.