TI: Lead Times Continue to Extend
TI is facing increasing supply pressure following the reallocation of part of its production capacity toward NVIDIA-related demand. Market feedback indicates that some orders originally scheduled for June delivery have already been postponed to October, with the possibility of further delays. Meanwhile, lead times for new orders have extended from approximately 12 weeks to more than 20 weeks. Combined with the impact of multiple rounds of price increases, order fulfillment stability has declined noticeably. Production scheduling and delivery timelines for certain products remain highly volatile. Customers are advised to plan procurement requirements well in advance and closely monitor order status updates.
Microchip: Lead Times for Certain Products Exceed 30 Weeks
Microchip recently introduced its next-generation XpressConnect™ PCIe 6.0 and CXL 3.1 retimer solutions, targeting memory expansion and resource pooling applications within large-scale AI computing networks. On the supply side, demand for AI power-related products continues to rise. Lead times for product families such as dsPIC33AK and PIC32MK have generally exceeded 20 weeks, while certain power devices and ICs now carry lead times of more than 30 weeks. At the same time, lead times for general-purpose 8-bit and 16-bit MCUs have also extended compared with previous periods. Market sources indicate that Microchip is evaluating a new round of price adjustments in response to rising raw material costs. A formal price increase announcement could be issued as early as late June and no later than July.
Micron: 1α DRAM Enters Production
Micron has announced the official launch of 1α DRAM production at its manufacturing facility in Manassas, Virginia, USA. The technology will primarily support the production of DDR4 and LPDDR4 products and is expected to reach full-scale manufacturing by the end of the year. As additional capacity comes online, Micron’s overall DDR4 supply capability is expected to improve, providing incremental support to the currently tight memory market.
SK hynix: Plans to Double Memory Wafer Capacity Within Five Years
SK hynix has announced plans to continue expanding its memory manufacturing footprint, with a goal of doubling memory wafer production capacity over the next five years. The company expects supply-demand tightness across the global memory market to persist through 2030, driven by continued growth in AI servers and high-performance computing applications. SK hynix also confirmed that a recent factory fire incident did not affect semiconductor production operations, while the root cause of the event remains under investigation.
Infineon: Launches Capacity Transfer Plan for Mexico Facility
Infineon has announced a phased shutdown of semiconductor backend manufacturing operations at its Tijuana, Mexico facility. Capacity related to wafer dicing, packaging, and testing will gradually be transferred to other manufacturing locations. The company stated that the transition will be executed in stages and is not expected to impact customer supply commitments. However, Infineon has not yet disclosed which production sites will assume the transferred capacity.
Onsemi: Demand from AI and New Energy Vehicles Continues to Accelerate
From a demand perspective, market activity remains concentrated in new energy vehicles (NEVs), AI data centers, photovoltaic energy storage, industrial automation, and consumer electronics, in descending order of momentum. Among these segments, NEVs and AI servers continue to serve as the primary growth drivers for power semiconductor demand. From a product portfolio perspective, onsemi recently launched a complete family of 600V high-voltage MOSFETs targeting AI server and communications power applications. In addition, the AR0821CS CMOS image sensor for automotive and industrial vision applications has officially entered mass production.
Samsung: Hungarian Facility to Support Volkswagen Unified Battery Program
Samsung SDI is currently upgrading selected production lines at its Göd, Hungary facility to support the Volkswagen Group’s Unified Battery program. Equipment installation is already underway, with mass production expected to begin next year. Industry estimates suggest the project could eventually achieve annual capacity in the double-digit GWh range, further strengthening Samsung SDI’s position within the European new energy vehicle supply chain.
MediaTek and Foxtron Partner to Advance AI-Driven Smart Vehicles
MediaTek has announced a long-term strategic partnership with Foxtron, the electric vehicle venture backed by Foxconn Group, to accelerate the development of AI-powered intelligent vehicles. The collaboration will combine MediaTek’s Dimensity Auto Cockpit Platform C-X1 with NVIDIA GPU and AI technologies to create next-generation intelligent cockpit solutions featuring enhanced computing performance and advanced human-machine interaction capabilities for premium vehicle platforms. The partnership reflects the accelerating transition toward “AI-defined vehicles” across the automotive industry and is expected to further stimulate demand for high-performance automotive semiconductors, intelligent cockpit platforms, and AI computing infrastructure.